Semiconductor chip (also known as Integrated Circuit, Integrated Circuit, IC) production is mainly divided into IC design, IC manufacturing, IC sealing test three aspects. The IC design is mainly based on the logic design and rule formulation of the chip design purpose, and the mask is made according to the design diagram for the subsequent photolithography step. IC fabrication transfers the circuit diagram of the chip from the mask to the silicon wafer, and implements the target chip functions, including chemical mechanical grinding, film deposition, lithography, etching, ion implantation and other steps. IC encapsulation test completes the packaging and performance and function testing of the chip, which is the final process before product delivery.
Lithography is the most complex and critical process step in the semiconductor chip production process, which is time-consuming and costly. The difficulty and key point of semiconductor chip production is how to make the target circuit pattern on the silicon wafer, which is realized by lithography, and the process level of lithography directly determines the process level and performance level of the chip. In general, the chip needs 20-30 times of lithography in production, which takes up about 50% of the IC production link and accounts for 1/3 of the chip production cost.
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