1, Endura@HP PVD system is a fully automatic physical vapor deposition (PVD) system, using a single chip process, multi-cavity design. The system is 8 "(200 mm wafer). It uses a stepped-vacuum system that allows for short pump drops to achieve ultra-high vacuum. The multi-chamber design allows precise control of all process parameters.
2, CH-1, 2, 3, 4 DC magnetron sputtering deposition chamber for depositing interconnect metallized materials. Commonly deposited materials are aluminum (Al), titanium (Ti), titanium nitride (TiN), and tungsten titanium (TiW). Expansion chamber CH-C&CH-D, optionally configured for PVD or other processes such as CVD and corrosion. Up to six PVD chambers can be installed in a standard system.
3, stable and reliable operation, good uniformity of film thickness.
Quality
Standard domestic and foreign advanced technology and indicators, quality system certification
Price
Customize the best price and service
Service
Localization service team, quick response to customers, on-site technical support, full life cycle careDelivery time
Rich types of equipment reserve, flexible allocation of resources