Lithography is the most complex and critical process step in the semiconductor chip production process, which is time-consuming and costly. The difficulty and key point in semiconductor chip production lies in how to create target circuit patterns on silicon wafers, which is achieved through photolithography. The level of photolithography technology directly determines the process and performance level of the chip.
Principle: The light source shines on the surface of the substrate with a layer of photoresist film through the mask, causing a chemical reaction of the photoresist in the exposed area. Then, the photoresist in the exposed or unexposed area is dissolved and removed through development technology (the former is called positive photoresist, the latter is called negative photoresist), so that the patterns on the mask are copied onto the photoresist film. Finally, the patterns are transferred to the substrate through etching technology.
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