The basic principle is to first process a mask of a specific pattern on the surface of a semiconductor material, and then use the RIE/ICP device to control the etching gas to etch away the place where there is no mask, and finally leave a specific pattern
Quality
Standard domestic and foreign advanced technology and indicators, quality system certification
Price
Customize the best price and service
Service
Localization service team, quick response to customers, on-site technical support, full life cycle careDelivery time
Rich types of equipment reserve, flexible allocation of resources