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Bonding machine

Two homogeneous or heterogeneous wafers are closely combined by chemical and physical action, so as to realize the electrical interconnection, function integration and device packaging of microelectronic materials, photoelectric materials and nano-level MEMS
  • Product details

Two homogeneous or heterogeneous wafers are closely combined by chemical and physical action, so as to realize the electrical interconnection, function integration and device packaging of microelectronic materials, photoelectric materials and nano-level MEMS

ADVANTAGES
  • Quality

    Standard domestic and foreign advanced technology and indicators, quality system certification
  • Price

    Customize the best price and service
  • Service

    Localization service team, quick response to customers, on-site technical support, full life cycle care
  • Delivery time

    Rich types of equipment reserve, flexible allocation of resources